Surface Mount Technology (SMT).

SURFACE MOUNT TECHNOLOGY (SMT)

ATTACHING COMPONENTS TO THE CIRCUIT BOARD‍

Global Electronics B.V. is specialized in Surface Mount Technology. During the SMT process, components are attached to the PCB by putting the contact pins on the PCB instead of through the PCB, as in Through Hole Technology (THT).

For placing these components, we have two fully automated production lines with inline AOI (automated optical inspection). You can therefore rely on top quality thanks to this automated inspection. One line is set up for large series and the other line for prototypes up to medium volumes (batches of 1 to 10,000 pieces).

The techniques we offer with SMT:

- Reflow soldering

With this technique, each product receives its own solder profile based on component selection and stack-up of the PCBA. We check these profiles periodically and adjust them where necessary so that we are always working within the applicable standard.

- Vapor phase soldering

The consistently stable temperature and oxygen-free environment make it possible to solder PCBAs with complex heat management using this technique.

- Wave soldering

This method is used when combining SMT on "bottom side" and THT on "top side" of the PCBA. The technique has now been largely replaced by the combination of reflow with selective soldering, but we still have machines and knowledge in the field of wave soldering.