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Surface Mount Technology (SMT)

SURFACE MOUNT TECHNOLOGY (SMT)


ATTACH COMPONENTS TO THE CIRCUIT BOARD
Global Electronics B.V. specializes in Surface Mount Technology. During the SMT processcomponents are attached to the PCB because the contact pins come on the PCB instead of through the PCB, as with Through Hole Technology (THT).

For the installation of these components we have two fully-automated production lines with in-line AOI (automated optical inspection). Thanks to this automated inspection you can rely on top quality. One line is designed for large series and the other line for prototypes to medium volumes (batches of 1 to 10,000 pieces). 

The techniques we provide with SMT:

- Reflow soldering

With this technique, each product gets its own solder profile based on component choice and stack-up of the PCBA. We check these profiles periodically and adjust them where necessary, so we always work within the applicable standard.


- Vapor phase soldering

The constantly stable temperature and oxygen-free environment make it possible to solder PCBAs with complex heat management using this technique.


- Wave soldering

This method is used in the combination of SMT on the bottom side and THT on the top side of the PCBA. The technique has now largely been replaced by the combination of reflow with selective soldering, but we still have machines and knowledge in the field of wave soldering.

BGA DESOLDERING AND SOLDERING

With the help of our hot-air BGA repair station we can "desolder" and replace all imaginable components, including soldering under controlled profile conditions. Would you like advice for your specific situation? Then contact us.

Growing Together

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